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Fully Automatic Mini LED Bonding Equipment

Products & Services > Display Semiconductor Industry Solutions > Fully Automatic Mini LED Bonding Equipment
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Fully Automatic Mini LED Bonding Equipment

The MLU45 Die Bonder features a high-precision bonding platform with wide substrate size compatibility, catering to large and extra-large size Mini BLU product bonding. It maintains advantages like high die bonding accuracy, capacity, yield, and rst-pass rate, helping customers achieve high quality mass production of Mini backlight display products. With listed capacity advantages, the equipment can reduce xed asset investment for the entire line.

Applied for die bonding in Mini LED backlight products.

Product Inquiry Hotline：+86-138-1192-8592（Mr. Mao）
Product Inquiry Email： jian.mao@incubecn.com

  • Equipment integrates advanced technologies: high-speed & precision mechanical design, software systems, machine vision, motion control, and algorithms.

  • The die bonding head adopts a self-developed se o motor direct-drive rotation and independently driven voice coil motors for arm up/down movement.

  • Left and right bonding heads are movable, meeting compatibility requirements for substrates of di erent widths andcapacity maximizing.

  • Linear motor drives are applied for picking up and bonding platforms to achieve high speed and precision positioning.

  • Bonding platform of wide compatibility and high-precision laser height measurement contributed to higher bonding accuracy.

  • The ying vision function at bottom and 360° rotatable arm nozzles make chip angle correction after pick-up and automatically identify chip polarity.

  • Software system can be operated friendly and stably, easy to integrate with MES system.

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