Adapt to chip packaging speci cations: QFP, BGA, Micro BGA, PLCC, TSOP, CSP, PGA
Multi testing capability designed speci cally for large-scale production with long TT time
Higher UPH meets the demand for rapid production
Maintain a low failure rate during large-scale operation
High precision visual alignment for material picking and placing
Automatic adjustment of product loading, unloading, suction and blowing force