中文
中文

High Accuracy Multi-die Flip-Chip Die Bonder

Products & Services > IC Packaging & Testing Industry Solutions > High Accuracy Multi-die Flip-Chip Die Bonder
    • 1

High Accuracy Multi-die Flip-Chip Die Bonder

The MDB-FC300 is an advanced flip chip die bonding system designed to meet the high-precision requirements of semiconductor advanced packaging. The system delivers exceptional accuracy, speed, and flexibility, making it ideal for high-volume production of flip chip devices. Engineered for superior performance, The MDB-FC300integrates cutting-edge vision alignment, force control, and High dynamic performance technologies to ensure reliable placement of dies with micron-meters level precision.

Application Market: Consumer Electronics, High-Pe ormance Computing (HPC), AI, Wireless, 5G & RF, etc.
Package Type: FCCSP, WLCSP, FC-BGA, HD Fan-out, eWLB, CoW MCM, FOWLP, FOPLP.

Product Inquiry Hotline：+86-138-1192-8592（Mr. Mao）
Product Inquiry Email： jian.mao@incubecn.com

  • Multi-chip placement with high speed, high flexibility, and high precision

  • Supports various substrate types: Leadframe, Strip, Wafer, Panel

  • Compatible with 300mm/340mm wafer-level/panel-level fan-out packaging (FOWLP, FOPLP)

  • Precision force control of ±0.1N, with maximum placement force up to 50N

  • Utilizes a precision mineral-cast body and high-rigidity frame to enhance system dynamic performance, ensuring productivity and accuracy

  • Incorporates proprietary multi-point-of-interest error compensation technology and temperature drift compensation algorithms

Previous： The Fast And Reliable 12 Inch Soft Solder Die Bonding System
Next： SCHNEEBERGER Precision Motion System