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Wafer To Wafer High Precision Rearrangement Sorting Machine

Products & Services > IC Packaging & Testing Industry Solutions > Wafer To Wafer High Precision Rearrangement Sorting Machine
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Wafer To Wafer High Precision Rearrangement Sorting Machine

The High-Precision Wafer Integration Equipment is a machine that rearranges dies from a Wafer onto blue tape with high precision.

High-precision rearrangement application of single Die/Chip from blue tape to blue tape.

Product Inquiry Hotline：+86-138-1192-8592（Mr. Mao）
Product Inquiry Email： jian.mao@incubecn.com

  • Incoming material compatible with 12-inch and 8-inch Disco iron rings

  • Outgoing material compatible with 12-inch, 8-inch Disco iron rings

  • Pickup die size range 0.15*0.15mm ~ 6*6mm, T ≤ 800μm

  • UPH 27K (0.2*0.2mm die, placement pitch ≤1.2mm)

  • Rearrangement accuracy X, Y ≤ ±10um & angle ≤ ±0.5°

  • Front-side and back-side AOI inspection to avoid mixing defective dies

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