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Fully Automatic Eutectic Bonding Equipment

Products & Services > Semiconductor > Fully Automatic Eutectic Bonding Equipment
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Fully Automatic Eutectic Bonding Equipment

The Fully Automatic Eutectic Bonder is a machine specially designed for chip eutectic bonding. Mainly used for TO, COC, COB and other packaging processes, it bonds the substrate and chip via eutectic bonding through high-temperature heating.

Mainly applied to chip eutectic bonding processes, such as bonding for TO, COC, COB, and other chips.

Product Inquiry Hotline：+86-138-1192-8592（Mr. Mao）
Product Inquiry Email： jian.mao@incubecn.com

  • Granite structure, linear motor gant , stable machine operation, high precision.

  • Bonding nozzle force control closed-loop, pressure range selectable.

  • Pulse heating, air-cooled worktable, stable heating/cooling cu es.

  • Replaceable bonding table.

  • Bonding accuracy 5-10 microns.

  • Both upper and lower su aces of the chip equipped with visual imaging for positioning.

  • UPH 500+ (dened based on actual process).

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