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Fully Automatic LED HSP Map Sorter

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Fully Automatic LED HSP Map Sorter

The MS3300 LED Chip High - Speed So er is equipment used in the chip semiconductor indust . It is mainly applied for the rearrangement, so ing, and multi-chip mixing of LED chips with sizes of 2 mil and above. It is a specialized machine that combines scanning the wafer MAP and comparing it with the loaded le MAP to pick chips with the same BIN number onto the same lm sheet.

Application Scenarios: Single Die so ing process from blue tape to blue tape (three-station).

Product Inquiry Hotline：+86-138-1192-8592（Mr. Mao）
Product Inquiry Email： jian.mao@incubecn.com

  • Wafer side compatible with 8-inch and below mating rings and 6-inch and below Disco rings. Bin side suppo s 205 mm and 195mm iron rings.

  • Pick die size sho side: 2 mil ~ 45mil.

  • Normal so ing capacity for 04*06mil size chips: 6.6KK/day (with pe ormance binning / so ing based on F-parameter, 97% operational rate).

  • Die bonding accuracy X, Y≤±15um & angle≤±3°, STD can reach within 3.5.

  • Provides various standard mixing methods, and can o er customized mixing methods according to customer process requirements.

  • Software suppo s multiple modes: normal pick, reverse pick, reverse blow, reverse suction, rearrangement, mixing, etc.

  • Executes automatic handling of speci c alarms and maintenance procedures.

  • Provides central control system se ice, enabling remote operation of the machine and real-time display of equipment status.

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