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Multi Die Bonder

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Multi Die Bonder

Specially designed for high-precision, multi-die, complex process die bonding. Possesses high-precision mechanical motion control platforms, machine vision, and algorithms. Highly modular design supports flexible configuration. Optimized algorithms and precise force control ensure placement quality. Supports glue dispensing, dipping, flux dipping, die bonding, eutectic bonding, flip-chip, and other processes. Widely used in memo , industrial lasers, optical communications, LiDAR, CIS, MEMS, IGBT, and other industries.

Applicable to CIS, MEMS, memo chips, power devices, optical devices/modules, etc.

Product Inquiry Hotline：+86-138-1192-8592（Mr. Mao）
Product Inquiry Email： jian.mao@incubecn.com

  • High Precision: Position: +/-3um; Angle: +/-0.07°; Bond Force: 40g-1500g; applicable for various alignment methods: up-look camera and down-look camera, etc.; Advanced real-time compensationalgorithm with precise force control to ensure placement quality

  • Multi-Die: automatic wafer change: up to 25 wafers; automatic nozzle change: standard 7, optional14; automatic ejector pin change: up to 5.

  • Flexibility: Modular, available for various pickup and bonding methods; Full automatic calibrationsystem; Dual dispensing system, including glue dispensing, glue dipping, flux dipping; also availablefor flip-chip method.

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