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The Fast And Reliable 12 Inch Soft Solder Die Bonding System

Products & Services > Semiconductor > The Fast And Reliable 12 Inch Soft Solder Die Bonding System
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The Fast And Reliable 12 Inch Soft Solder Die Bonding System

The DA6008+ is a 12-inch fully automatic, highly reliable soft solder die bonding system, applied in standard power packaging, high-power packaging, power IC packaging, special high-power packaging, intelligent power (IPM), and other fields. It bonds chips to frames via fixed-shape tin fluid which comes from a process of solder dot deposition and film pressing.

Mainly applied to die bonding/placement processes for TO-220, TO-247 or 3P, TO-252, PPAK, DPAK, PDFN, and other power devices.

Product Inquiry Hotline：+86-138-1192-8592（Mr. Mao）
Product Inquiry Email： jian.mao@incubecn.com

  • With bottom support, the track can be upgraded with HF function for Diffusion solder

  • Product change/track disassembly is friendly (easy to flip open lid), requiring minimal calibration settings

  • Track has better air tightness, consistent with ESEC

  • Track is interchangeable with ESEC2009 machine, operation interface is basically the same as ESEC2009

  • Solder dispensing mechanism can switch between single dot solder + press film or double solder writing. Press film head is interchangeable with ESEC, ASM

  • The only domestic equipment following the European technical route in China, with longer useful life and lower spare part failure rate. Process route was developed according to top domestic packaging house standards

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