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Wafer To Panel Sorting Machine

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Wafer To Panel Sorting Machine

The WTP Panel Sorter is a sorting and paneling machine that transfers single dies from Wafer’s blue tape to adhesive substrate.

Application Scenarios: Single Die/Chip sorting and paneling process from blue tape to substrate.

Product Inquiry Hotline：+86-138-1192-8592（Mr. Mao）
Product Inquiry Email： jian.mao@incubecn.com

  • Incoming material compatible with 12-inch, 8-inch Disco iron rings

  • Maximum substrate size: 330mm*334mm

  • Pickup die size range 0.15*0.15mm ~ 6*6mm, T ≤ 800μm

  • UPH 27K (0.2*0.2mm die, placement pitch ≤1.2mm)

  • Panel placement accuracy X, Y ≤ ±15um & angle ≤ ±1°

  • Front and back-side AOI inspection to avoid mixing defective dies

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